Team Canada-ISEF 2019 wins five awards

Fri, 2019-05-17 10:49 -- Reni Barlow


Phoenix, Arizona hosted the 2019 Intel International Science and Engineering Fair (Intel ISEF) May 12-18, where eight Canadian students competed for top prizes. The rigorous six day competition brought out the best in the approximate 1,800 students who participate every year from more than 80 countries. This amazing experience allows students to win prizes and scholarships which total an astonishing 5 million dollars. Canada was well represented by this talented group of students who brought home five awards. 

Kamron Zaidi and Sabrina Zaidi, from Richmond Hill, Ontario, brought home fourth place in plant sciences for their project which explores the effects of surface tension on plant growth in fogponics. 

Dheiksha Jayasankar, from St. Catharines, Ontario, also took home fourth place in plant sciences for her project called NanoAOX, which delivers antioxidants via nanoparticles to enhance plant growth. 

Nicolas Fedrigo, from Victoria BC, was awarded third place in the biomedical engineering division for his project which involved redesigning the pedicle probe to prevent vertebral breaches during spinal surgery. 

Brendon Matusch, from Sudbury, Ontario took home two prizes, second place in physics and astronomy, as well as the China Association for Science and Technology award. His project was focused on improving particle classification in weakly interacting massive particles (WIMP), essentially using neural networks to detect dark matter. Brendon was the 2018 Canada Wide Science Fair Best Project award winner.

Aaron Abraham, Kevin Hu and Michelle Song also represented the country with their projects. 

All eight students represented Canada with determination, creativity and ingenuity. Their hard work not only inspires their local communities but also fellow students across Canada.


Applications for Team Canada-ISEF 2020 open in September with a deadline of December 15. The next ISEF takes place May 10-15, 2020 in Anaheim, California.